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HSDL-3612
IrDA(R) Data Compliant 115.2 kb/s 3 V to 5 V Infrared Transceiver
DataSheet
Description
Features
* FullycomplianttoIrDA1.0physicallayerspecifications -9.6kb/sto115.2kb/soperation * Typicallinkdistance>1.5m * IEC825-Class1eyesafe * Lowpoweroperationrange-2.7Vto5.25V * Smallmodulesize-4.0x12.2x5.1mm(HxWxD) * Completeshutdown-TXD,RXD,PINdiode * Lowshutdowncurrent-10nAtypical * Adjustableopticalpowermanagement-Adjustable LEDdrive-currenttomaintainlinkintegrity * IntegratedEMIshield-Excellentnoiseimmunity * Edgedetectioninput-PreventstheLEDfromlong turn-ontime * InterfacetovarioussuperI/Oandcontrollerdevices * Designedtoaccommodatelightlosswithcosmetic window * Only2externalcomponentsarerequired * Leadfreepackage Pb-free and EU RoHS compliant
The HSDL-3612 is a low-profile infrared transceiver module that provides interface between logic and IR signalsforthrough-air,serial,half-duplexIRdatalink. The module is compliant to IrDA Data Physical Layer Specifications1.4andIEC825-Class1EyeSafe.
Applications
* Digitalimaging -Digitalstillcameras -Photo-imagingprinters * Datacommunication -Notebookcomputers -DesktopPCs -WinCEhandheldproducts -PersonalDigitalAssistants(PDAs) -Printers -Faxmachines,photocopiers -Screenprojectors -AutoPCs -Dongles -Set-Topbox * Telecommunicationproducts -Cellularphones -Pagers * Smallindustrial&medicalinstrumentation -Generaldatacollectiondevices -Patient&pharmaceuticaldatacollectiondevices
Functional Block Diagram
VCC R1 LEDA (10)
TXD (9)
SP
MD0 (4) MD1 (5)
HSDL-3612
RXD (8)
CX1 GND (7,3) CX2 VCC (1) AGND (2)
The HSDL-3612 contains a high-speed and high-efficiency870nmLED,asiliconPINdiode,andanintegratedcircuit.TheICcontainsanLEDdriverandareceiver providing a single output (RXD) for all data rates supported. TheHSDL-3612canbecompletelyshutdowntoachieve verylowpowerconsumption.Intheshutdownmode, thePINdiodewillbeinactiveandthusproducingvery little photo-current even under very bright ambient light. The HSDL-3612 also incorporated the capability for adjustable optical power. With two programming pins; MODE 0 and MODE 1, the optical power output can be adjusted lower when the nominal desired link distanceisone-thirdortwo-thirdofthefullIrDAlink. The HSDL-3612 front view options (HSDL-3612-007/037) and a top view packaging option (HSDL-3612008/-038) come with integrated shield that helps to ensure low EMI emission and high immunity to EMI field,thusenhancingreliableperformance.
Application Support Information
TheApplicationEngineeringgroupisavailabletoassist you with the technical understanding associated with HSDL-3612infraredtransceivermodule.Youcancontact them through your local sales representatives for additionaldetails.
Ordering Information
Package Option Package FrontView FrontView TopView TopView Part Number HSDL-3612-007 HSDL-3612-037 HSDL-3612-008 HSDL-3612-038 Standard Package Increment 400 1800
400 1800
2
I/O Pins Configuration Table Pin 1 2 3 4 5 6 7 8 9 10 Description SupplyVoltage AnalogGround Ground Mode0 Mode1 NoConnection Ground ReceiverDataOutput TransmitterDataInput LEDAnode Symbol VCC AGND GND MD0 MD1 NC GND RXD TXD LEDA
10
9
8
7
6
5
4
3
2
1
BACK VIEW (HSDL-3612-007/-037)
10
9
8
7
6
5
4
3
2
1
BOTTOM VIEW (HSDL-3612-008/-038)
Transceiver Control Truth Table Mode 0 1 0 0 1 Mode 1 0 0 1 1 RX Function Shutdown SIR SIR SIR TX Function Shutdown FullDistancePower 2/3DistancePower 1/3DistancePower
Transceiver I/O Truth Table Transceiver Mode Active Active Active Shutdown Inputs TXD 1 0 0 X[3] EI X High[1] Low Low Outputs LED On Off Off NotValid RXD NotValid Low[2] High NotValid

X=Don'tCare
EI=In-BandInfraredIntensityatdetector
Notes: 1. In-BandEl115.2kb/s. 2. LogicLowisapulsedresponse.Theconditionismaintainedfordurationdependentonthepatternandstrengthoftheincidentintensity. 3. Tomaintainlowshutdowncurrent,TXDneedstobedrivenhighorlowandnotleftfloating.
3
Recommended Application Circuit Components Component R1 CX1[4] CX2[5] Recommended Value 6.25%,0.5Watt,for2.7VCC3.6Voperation 15.05%,0.5Watt,for4.75VCC5.25Voperation 0.47F20%,X7RCeramic 6.8F20%,Tantalum
Notes: 4.CX1mustbeplacedwithin0.7cmoftheHSDL-3612toobtainoptimumnoiseimmunity. 5.In"HSDL-3612FunctionalBlockDiagram"onpage1itisassumedthatVledandVCCsharethesamesupplyvoltageandfiltercapacitors.Incase the2pinsarepoweredbydifferentsuppliesCX2isapplicableforVledandCX1forVCC.Inenvironmentswithnoisypowersupplies,including CX2ontheVCClinecanenhancesupplyrejectionperformance.
0.7 0.6 0.5 LOP (mW/sr) 1.5 1.7 1.9 2.1 2.3 ILED (A) 0.4 0.3 0.2 0.1 0 1.3
200 180 160 140 120 100 80 60 40 20 0 0 30 60 90 120 150 180 210 240 270 300
LEDA VOLTAGE (V)
ILED vs. LEDA.
ILED (mA)
Light Output Power (LOP) vs. ILED.
Marking Information
The HSDL-3612-007/-037 is marked "3612YYWW" on the shield where"YY" indicates the unit's manufacturingyear,and"WW"referstotheworkweekinwhichthe unitistested.
CAUTIONS: The BiCMOS inherent to the design of this component increases the component's susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
4
Absolute Maximum Ratings[6] Parameter StorageTemperature OperatingTemperature DCLEDCurrent PeakLEDCurrent LEDAnodeVoltage SupplyVoltage TransmitterData InputCurrent ReceiverData OutputVoltage Symbol TS TA ILED(DC) ILED(PK) VLEDA Vcc ITXD(DC) VO Minimum -40 -20 -0.5 0 -12 -0.5 Maximum +100 +70 165 750 7 7 12 Vcc+0.5 Unit C C mA mA V V mA V Conditions
2spulsewidth, 10%dutycycle
|IO(RXD)|=20A
Note: 6.Forimplementationswherecasetoambientthermalresistance50C/W.
Recommended Operating Conditions Parameter OperatingTemperature SupplyVoltage LogicHighInputVoltage forTXD,MD0,MD1,andFIR_SEL LogicLowTransmitterInputVoltage LED(LogicHigh)CurrentPulseAmplitude ReceiverSignalRate Symbol TA VCC VIH VIL ILEDA Minimum -20 2.7 2VCC/3 0 180 2.4 Maximum +70 5.25 VCC VCC/3 300 115.2 Unit C V V V mA kb/s
5
Electrical & Optical Specifications SpecificationsholdovertheRecommendedOperatingConditionsunlessotherwisenoted.Unspecifiedtestconditionscanbeanywhereintheiroperatingrange.Alltypicalvaluesareat25Cand3.3Vunlessotherwisenoted.

Parameter Transceiver Supply Shutdown Current Idle DigitalInput Logic Current Low/High Transmitter Transmitter LogicHigh Radiant Intensity Intensity Peak Wavelength Spectral LineHalf Width ViewingAngle OpticalPulse Width RiseandFall Times Maximum OpticalPulse Width LEDAnode OnStateVoltage LEDAnode OffStateLeakageCurrent
Symbol ICC1 ICC2 IL/H
Min. -1
Typ. 10 2.5
Max. 200 5 1
Unit nA mA A
Conditions VI(TXD)VILor VI(TXD)VIH VI(TXD)VIL,EI=0 0VIVCC
EIH P 1/2
50
120 875 35
400
mW/sr nm nm
VIH=3.0V ILEDA=200mA 1/215
21/2 tpw(EI) tr(EI), tf(EI) tpw(max)
30 1.5
1.6 20
60 1.8 40 50
s ns s
tpw(TXD)=1.6sat 115.2kb/s tpw(TXD)=1.6sat 115.2kb/s tr/f (TXD)=10ns TXDpinstuckhigh
VON(LEDA) ILK(LEDA)
1
2.4 100
V nA
ILEDA=200mA, VI(TXD)VIH VLEDA=VCC=5.25V, VI(TXD)VIL
6
Electrical & Optical Specifications SpecificationsholdovertheRecommendedOperatingConditionsunlessotherwisenoted.Unspecifiedtestconditionscanbeanywhereintheiroperatingrange.Alltypicalvaluesareat25Cand3.3Vunlessotherwisenoted. Parameter
Symbol VOL VOH 21/2 EIH EIL P tpw(SIR) tL tr/f(RXD) tW
Min. 0 VCC-0.2 30 0.0036 1
Typ. - - 880 20 25
Max. 0.4 VCC 500 0.3 4.0 50 100
Unit V V mW/cm2 W/cm2 nm s s ns s
Conditions IOL=1.0mA, EI3.6W/cm2, 1/215 IOH=-20A, EI0.3W/cm2, 1/215 Forin-bandsignals 115.2kb/s[8] Forin-bandsignals[8]

Receiver Receiver LogicLow[7] DataOutput Voltage LogicHigh ViewingAngle LogicHighReceiverInput Irradiance LogicLowReceiverInput Irradiance ReceiverPeakSensitivity Wavelength ReceiverSIRPulseWidth ReceiverLatencyTime ReceiverRise/FallTimes ReceiverWakeUpTime
1/215[9],CL=10pF
[10]
Notes: 7.LogicLowisapulsedresponse.Theconditionismaintainedfordurationdependentonpatternandstrengthoftheincidentintensity. 8. Anin-bandopticalsignalisapulse/sequencewherethepeakwavelength,lp,isdefinedas850lp900nm,andthepulsecharacteristics arecompliantwiththeIrDASerialInfraredPhysicalLayerLinkSpecification. 9. Forin-bandsignals115.2kb/swhere3.6W/cm2EI500mW/cm2. 10. WakeUpTimeisthetimebetweenthetransitionfromashutdownstatetoanactivestateandthetimewhenthereceiverisactiveand readytoreceiveinfraredsignals.
7
TXD "Stuck ON" Protection
TXD
LED
tpw (MAX.)
RXD Output Waveform
tpw VOH 90% 50% 10%
VOL
tf
tr
LED Optical Waveform
tpw LED ON
90% 50% 10%
LED OFF
tr
tf
Receiver Wake Up Time Definition (when MD0 1 and MD1 0)
RX LIGHT
RXD
VALID DATA
tw
8
HSDL-3612-007 and HSDL3612-037 Package Outline with Dimension and Recommended PC Board Pad Layout
MOUNTING CENTER PIN 1 2 3 4 5 FUNCTION VCC AGND GND MD0 MD1 PIN 6 7 8 9 10 FUNCTION NC GND RXD TXD LEDA 4.98 1.17 4.18 6.10
TOP VIEW
2.45
R 2.00
R 1.77
4.00 1.90 0.80 1.20 4.05 SIDE VIEW ALL DIMENSIONS IN MILLIMETERS (mm). DIMENSION TOLERANCE IS 0.20 mm UNLESS OTHERWISE SPECIFIED. MOUNTING CENTER PIN 1 0.70 0.43 1.05
PIN 10 PIN 1
1.90 0.80 1.70 3.24 12.20 FRONT VIEW 3.84
PIN 10
MID OF LAND
2.40
2.08 0.70 4.95 0.45 2.35
10 CASTELLATION: PITCH 1.1 0.1 CUMULATIVE 9.90 0.1 BACK VIEW
2.84 LAND PATTERN
9
HSDL-3612-008 and HSDL3612-038 Package Outline with Dimension and Recommended PC Board Pad Layout
11.7 5 0.36 0.53 0.47 0.85
R2
2.5
0.31
0.31
0.83 2.08 0.3
R2
.3
.1
3.85 +0.05 4.16 -0.00 2.08
0.84
0.42 0.94 5 3.24
1.46
2.57 3.84 5
0.28 1.77 +0.05 2.15 -0.00
12.2 +0.10 -0.00
+0.05 11.7 -0.00
0.1 4.65
R2
R1
.77
0.1
0.94 0.8 0.73
1.95
10
Tape and Reel Dimensions (HSDL-3612-007, -037)
ALL DIMENSIONS IN MILLIMETERS (mm) QUANTITY = 400 PIECES PER REEL (HSDL-3612-007) 1800 PIECES PER TAPE (HSDL-3612-037)
13.00 0.50 R 1.00 (40 mm MIN.) EMPTY PARTS MOUNTED (400 mm MIN.) LEADER
21.00 0.80 2.00 0.50 DIRECTION OF PULLING EMPTY (40 mm MIN.)
CONFIGURATION OF TAPE LABEL
SHAPE AND DIMENSIONS OF REELS
A
10
4 AE1.55 0.05
5 2.00 0.10
6 4.00 0.10
B
3 1.75 0.10 5 (MAX.) 11.50 0.10 2
A 3.8
24.00 0.30 1 AE1.5 0.1 A A 8.00 0.10 7 A 8 B
12 12.50 0.10
10 11
0.40 0.10 4.25 0.10 SECTION B-B
5 (MAX.)
4.4 A 5.20 0.10 SECTION A-A 9 A
11
Tape and Reel Dimensions (HSDL-3612-008, -038)
ALL DIMENSIONS IN MILLIMETERS (mm) QUANTITY = 400 PIECES PER REEL (HSDL-3612-008) 1800 PIECES PER TAPE (HSDL-3612-038)
13.00 0.50 R 1.00 (40 mm MIN.) EMPTY PARTS MOUNTED (400 mm MIN.) LEADER
21.00 0.80 2.00 0.50 DIRECTION OF PULLING EMPTY (40 mm MIN.)
CONFIGURATION OF TAPE LABEL
SHAPE AND DIMENSIONS OF REELS
Do
Po
P2
D1
B
E 5 (MAX.) F W Bo
8 0.10 A 5.4 0.15 5 (MAX.) A T Ko SECTION B-B
P1
B
Ao SECTION A-A SYMBOL SPEC SYMBOL SPEC Ao 4.4 0.10 E 1.75 0.10 Bo 12.50 0.10 F 11.5 0.10 Ko 4.85 0.10 Do 1.55 0.10 Po 4.0 0.10 D1 1.5 0.10 P1 8.0 0.10 W 24.0 0.3 P2 2.0 0.10 10Po 40.0 0.20 T 0.35 0.10
NOTES: 1. I.D. sprocket hole pitch cumulative tolerance is 0.2 mm. 2. Corner camber shall be not more than 1 mm per 100 mm through a length of 250 mm. 3. Ao and Bo measured on a place 0.3 mm above the bottom of the pocket. 4. Ko measured from a place on the inside bottom of the pocket to top surface of carrier. 5. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole.
12
Moisture Proof Packaging
All HSDL-3612 options are shipped in moisture proof package.Onceopened,moistureabsorptionbegins.
Recommended Storage Conditions
Storage Temperature Relative Humidity 10Cto30C below60%RH
Baking Conditions
Ifthepartsarenotstoredindryconditions,theymust bebakedbeforereflowtopreventdamagetotheparts.
Time from Unsealing to Soldering
After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. If times longer than168 hours are 72 needed,thepartsmustbestoredinadrybox.
Package Temp. Inreels 60C Inbulk 100C 125C 150C Bakingshouldbedoneonlyonce.
Time 48hours 4hours 2hours 1hour
UNITS IN A SEALED MOISTURE-PROOF PACKAGE
PACKAGE IS OPENED (UNSEALED)
ENVIRONMENT LESS THAN 30 C, AND LESS THAN 60% RH YES
NO BAKING IS NECESSARY
YES
THAN 72 HOURS
PACKAGE PACKAGE ISIS OPENED LESS OPENED LESS THAN168 HOURS
NO
PERFORM RECOMMENDED BAKING CONDITIONS
NO
13
Recommended Reflow Profile
230 200 183 170 150 125 100 R1 MAX. 245 C R3 R4
T - TEMPERATURE - ( C)
R2
90 sec. MAX. ABOVE 183 C
R5
50 25 0 P1 HEAT UP 50 100 150 200 250 P4 COOL DOWN 300
t-TIME (SECONDS) P2 P3 SOLDER PASTE DRY SOLDER REFLOW

Process Zone HeatUp SolderPasteDry SolderReflow CoolDown
Symbol P1,R1 P2,R2 P3,R3 P3,R4 P4,R5
DT 25Cto160C 160Cto200C 200Cto255C (260Cat10secondsmax.) 255Cto200C 200Cto25C
Maximum DT/Dtime 4C/s 0.5C/s 4C/s -6C/s -6C/s
The reflow profile is a straight-line representation of a nominaltemperatureprofileforaconvectivereflowsolderprocess.Thetemperatureprofileisdividedintofour process zones, each with different T/time temperature change rates. The T/time rates are detailed in theabovetable.Thetemperaturesaremeasuredatthe componenttoprintedcircuitboardconnections. In process zone P1, the PC board and HSDL-3612 castellation pins are heated to a temperature of 160C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4C per second to allow for even heating of both the PC board and HSDL-3612 castellations. Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperatureisraisedtoaleveljustbelowtheliquiduspoint ofthesolder,usually200C(392F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus pointofsolderto255C(491F)foroptimumresults.The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about
20 seconds to assure proper coalescing of the solder ballsintoliquidsolderandtheformationofgoodsolder connections. Beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections becomesexcessive,resultingintheformationofweakand unreliableconnections.Thetemperatureisthenrapidly reducedtoapointbelowthesolidustemperatureofthe solder,usually200C(392F),toallowthesolderwithin theconnectionstofreezesolid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solderto25C(77F)shouldnotexceed6Cpersecond maximum. This limitation is necessary to allow the PC board and HSDL-3612 castellations to change dimensions evenly, putting minimal stresses on the HSDL3612transceiver.
14
Appendix A: HSDL-3612-007/-037 SMT Assembly Application Note
1.0SolderPad,MaskandMetalSolderStencilAperture
STENCIL APERTURE METAL STENCIL FOR SOLDER PASTE PRINTING
LAND PATTERN
SOLDER MASK PCBA
Figure 1.0. Stencil and PCBA.
1.1 Recommended Land Pattern for HSDL-3612-007/-037
Dim. a b c(pitch) d e f g mm 2.40 0.70 1.10 2.35 2.80 3.13 4.31 Inches 0.095 0.028 0.043 0.093 0.110 0.123 0.170
SHIELD SOLDER PAD Tx LENS e Rx LENS
d b g
Y
f
a theta
X
FIDUCIAL
10x PAD
c
FIDUCIAL
Figure 2.0. Top view of land pattern.
15
1.2 Adjacent Land Keep-out and Solder Mask Areas Dim. h j k l mm min.0.2 13.4 4.7 3.2 Inches min.0.008 0.528 0.185 0.126
* Adjacent land keep-out is the maximum space occupiedbytheunitrelativetothelandpattern.There should be no other SMD components within this area. * "h"istheminimumsolderresiststripwidthrequired toavoidsolderbridgingadjacentpads. * Itisrecommendedthat2fiducialcrossbeplacedat mid-lengthofthepadsforunitalignment.
Note:Wet/LiquidPhoto-Imaginablesolderresist/maskisrecommended.
j
Tx LENS
Rx LENS
DIM. h j k l
mm MIN. 0.2 13.4 4.7 3.2
INCHES MIN. 0.008 0.528 0.185 0.126
LAND
h Y
SOLDER MASK
k
* ADJACENT LAND KEEP-OUT IS THE MAXIMUM SPACE OCCUPIED BY THE UNIT RELATIVE TO THE LAND PATTERN. THERE SHOULD BE NO OTHER SMD COMPONENTS WITHIN THIS AREA. * "h" IS THE MINIMUM SOLDER RESIST STRIP WIDTH REQUIRED TO AVOID SOLDER BRIDGING ADJACENT PADS. * IT IS RECOMMENDED THAT 2 FIDUCIAL CROSS BE PLACED AT MID-LENGTH OF THE PADS FOR UNIT ALIGNMENT.
l
Figure 3.0. HSDL-3612-007/-037 PCBA - Adjacent land keep-out and solder mask.
2.0 Recommended Solder Paste/Cream Volume for Castellation Joints Basedoncalculationandexperiment,theprintedsolder pastevolumerequiredpercastellationpadis0.30cubic mm(basedoneitherno-cleanoraqueoussoldercream typeswithtypically60to65%solidcontentbyvolume).
16
2.1 Recommended Metal Solder Stencil Aperture Itisrecommendedthatonly0.152mm(0.006inches)or 0.127mm(0.005inches)thickstencilbeusedforsolder pasteprinting.Thisistoensureadequateprintedsolder pastevolumeandnoshorting.Thefollowingcombination of metal stencil aperture and metal stencil thicknessshouldbeused: See Fig 4.0 t, nominal stencil thickness l, length of aperture mm inches mm inches 0.152 0.006 2.80.05 0.1100.002 0.127 0.005 3.40.05 0.1340.002 w,thewidthofapertureisfixedat0.70mm(0.028inches) Apertureopeningforshieldpadis2.8mmx2.35mmasperlanddimensions
APERTURE AS PER LAND DIMENSIONS t (STENCIL THICKNESS)
SOLDER PASTE
w
l
Figure 4.0. Solder paste stencil aperture.
3.0 Pick and Place Misalignment Tolerance and Product Self-Alignment after Solder Reflow Iftheprintedsolderpastevolumeisadequate,the unit will self-align in the X-direction after solder reflow. UnitsshouldbeproperlyreflowedinIRHotAirconvection oven using the recommended reflow profile. The directionofboardtraveldoesnotmatter.
Allowable Misalignment Tolerance X-direction0.2mm(0.008inches) Theta-direction2degrees
17
3.1 Tolerance for X-axis Alignment of Castellation Misalignmentofcastellationtothelandpadshouldnot exceed0.2mmorapproximatelyhalfthewidthofthe castellation during placement of the unit. The castellations will completely self-align to the pads during solderreflowasseeninthepicturesbelow.
Photo 1.0. Castellation misaligned to land pads in x-axis before reflow.
Photo 2.0. Castellation self-align to land pads after reflow.
3.2 Tolerance for Rotational (Theta) Misalignment Unitswhenmountedshouldnotberotatedmorethan 2degreeswithreferencetocenterX-Yasspecifiedin Fig2.0.Pictures3.0and4.0showunitsbeforeandafter reflow.UnitswithaThetamisalignmentofmorethan2 degreesdonotcompletelyselfalignafterreflow.Units with 2 degree rotational orTheta misalignment selfalignedcompletelyaftersolderreflow.
Photo 3.0. Unit is rotated before reflow.
Photo 4.0. Unit self-aligns after reflow.
18
3.3 Y-axis Misalignment of Castellation IntheY-direction,theunitdoesnotself-align aftersolderreflow. Itisrecommendedthattheunitbeplaced in line with the fiducial mark (mid-length of land pad.) This will enable sufficient land length (minimum of 1/2 landlength.)toformagoodjoint.SeeFig5.0.
LENS EDGE FIDUCIAL
Y
MINIMUM 1/2 THE LENGTH OF THE LAND PAD
Figure 5.0. Section of a castellation in Y-axis.
3.4 Example of Good HSDL-3612-007/-037 Castellation Solder Joints This joint is formed when the printed solder paste volume is adequate, i.e. 0.30 cubic mm and reflowed properly.ItshouldbereflowedinIRHot-airconvection reflowoven.Directionofboardtraveldoesnotmatter.
Photo 5.0. Good solder joint.
4.0 Solder Volume Evaluation and Calculation GeometryofanHSDL-3612-007/-037solderfillet.
0.425 0.20
0.8
1.2
0.70
0.4
0.7
19
Appendix B: HSDL-3612-008/-038 SMT Assembly Application Note
1.0.SolderPad,Mask,andMetalSolderStencilAperture
STENCIL APERTURE METAL STENCIL FOR SOLDER PASTE PRINTING
LAND PATTERN
SOLDER MASK PCBA
Figure 1. Stencil and PCBA.
1.1.RecommendedLandPatternforHSDL-3612-008/-038 Dim. a b c(pitch) d e f g mm 1.95 0.60 1.10 1.60 5.70 3.80 2.40 inches 0.077 0.024 0.043 0.063 0.224 0.123 0.170
SHIELD SOLDER PAD e
d g
Y
Rx LENS b theta Tx LENS f
X
h
a
FIDUCIAL
10x PAD
c
FIDUCIAL
20
2.0 Y-axis Misalignment of Castellation IntheY-direction,theunitdoesnotself-alignaftersolderreflow.Itisrecommendedthattheunitbeplacedin linewiththefiducialmark(mid-lengthoflandpad).This will enable sufficient land length (minimum of 1/2 land length)toformagoodjoint.SeeFigure2.
Y
FIDUCIAL 1/2 THE LENGTH OF THE CASTELLATION PAD
Figure 2. Section of a castellation in Y-axis.
21
Appendix C: Optical Port Dimensions for HSDL-3612:
To ensure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met without vignetting. The maximum dimensions minimize the effects of stray light. The minimum size correspondstoaconeangleof300andthemaximumsize correspondstoaconeangleof60. In the figure below, X is the width of the window,Y is the height of the window and Z is the distance from theHSDL-3612tothebackofthewindow.Thedistance from the center of the LED lens to the center of the photodiodelens,K,is7.08mm.Theequationsforcomputingthewindowdimensionsareasfollows: X=K+2*(Z+D)*tanA Y=2*(Z+D)*tanA The above equations assume that the thickness of the window is negligible compared to the distance of the module from the back of the window (Z). If they are comparable, Z' replaces Z in the above equation. Z' is definedas Z'=Z+t/n
where`t'isthethicknessofthewindowand`n'istherefractiveindexofthewindowmaterial. ThedepthoftheLEDimageinsidetheHSDL-3612,D,is 8mm.`A'istherequiredhalfangleforviewing.ForIrDA compliance, the minimum is 150 and the maximum is 300. Assuming the thickness of the window to be negligible, the equations result in the following tables and graphs:

Section of a castellation in Y-axis.
22

Module Depth, (z) mm 0 1 2 3 4 5 6 7 8 9

Aperture Width (x, mm) max. min. 16.318 11.367 17.472 11.903 18.627 12.439 19.782 12.975 20.936 13.511 22.091 14.047 23.246 14.583 24.401 15.118 25.555 15.654 26.710 16.190

Aperture height (y, mm) max. min. 9.238 4.287 10.392 4.823 11.547 5.359 12.702 5.895 13.856 6.431 15.011 6.967 16.166 7.503 17.321 8.038 18.475 8.574 19.630 9.110
23
Window Material
Almostanyplasticmaterialwillworkasawindowmaterial. Polycarbonate is recommended.The surface finish of the plastic should be smooth, without any texture. AnIRfilterdyemaybeusedinthewindowtomakeit look black to the eye, but the total optical loss of the window should be 10 percent or less for best optical performance.Lightlossshouldbemeasuredat875nm.
Shape of the Window
From an optics standpoint, the window should be flat. ThisensuresthatthewindowwillnotaltereithertheradiationpatternoftheLED,orthereceivepatternofthe photodiode. Ifthewindowmustbecurvedformechanicalorindustrial design reasons, place the same curve on the back side of the window that has an identical radius as the front side.While this will not completely eliminate the lenseffectofthefrontcurvedsurface,itwillsignificantly reduce the effects.The amount of change in the radiationpatternisdependentuponthematerialchosenfor thewindow,theradiusofthefrontandbackcurves,and the distance from the back surface to the transceiver. Oncetheseitemsareknown,alensdesigncanbemade whichwilleliminatetheeffectofthefrontsurfacecurve. The following drawings show the effects of a curved windowontheradiationpattern.Inallcases,thecenter thicknessofthewindowis1.5mm,thewindowismade of polycarbonate plastic, and the distance from the transceivertothebacksurfaceofthewindowis3mm.
Flat Window (First choice)
Curved Front and Back (Second choice)
Curved Front, Flat Back (Do not use)
24
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Data subject to change. Copyright (c) 2007 Lite-On Technology Corporation. All rights reserved.

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